Sure Connect is an initiative from the World Gold Council to support reliable interconnection in semiconductor packaging through the use of gold bonding wire, as well as gold-based finishes on contact and connectors.

Information is provided on this website to help chip packaging engineers and designers make informed decisions on bonding wire material type and contact finishes, based on the relative merits of each material option. Sponsored training courses are provided throughout the year to help train engineers and designers. The Sure Connect initiative also supports and publishes further research into the science of wire bonding with gold and copper, including an improved understanding of the reliability and process issues associated with each wire type.