The World Gold Council actively contributes to discussions on the use of gold in electronics packaging. With our partners we sponsor educational training workshops regarding best practice in wire bonding technology. Topics include design considerations for cost effective wire usage and critical material selection issues.

Our contributions are valued by technical managers and engineers at semiconductor packaging companies, equipment and material companies, as well as academics and research engineers at universities and research institutes.

We also sponsor, attend and participate in conferences focused on packaging technology. Recent and forthcoming events where we have contributed to the debate on material selection issues include:

International Conference on Electronics Packaging Technology (ICEPT) Xi’An China, August 17-19th 2010. 

International Electronics Manufacturing Technology Conference (IEMT), Melaka, Malaysia, Nov 30th-Dec 2nd 2010. 

Electronics and Packaging Technology Conference (EPTC), Singapore, Dec 8th-10th 2010.

CSTIC 2011, Shanghai, China, March 13-14, 2011

18th International Symposium on the Physical and Failure Analysis of Integrated Circuits, Incheon Korea,  July 4-7, 2011  

International Conference on Electronic Packaging Technology & High Density Packaging (ICEPT), August 8-11, 2011, Shanghai, China

'Wire bonding seminar’ Selangor, Malaysia, 22-23rd September 2011 (Contact us for details)