Gold Bulletin is the international journal on the science, technology and applications of gold, presenting the latest advances in research, state-of-the-art reviews and highlights of patents and scientific literature.  Published for more than 40 years Gold Bulletin has an outstanding archive of open access scientific publications focused on the use of gold as a contact finish, printed circuit board (PCB) finish, thick film ink and bonding wire material.

These papers are accessible at no charge via the Gold Bulletin website here

Avoiding Porosity in Gold Plating
H. S. Campbell, 1971, 4(1), 12-14

High Speed Gold Plating
anon., 1971, 4(4), 72

Adhesion (the) of Gold Electrodeposits
M. A. M. Bakker, 1972, 5(4), 82-84

Gold Plating of Semiconductor Devices
W. A. Fairweather, 1973, 6(2), 46-47

Gold Plating in the Electronics Industry
F. H. Reid, 1973, 6(3), 69-71

Gold Plating in Submarine Telephone Cable Repeaters
D. S. Girling, 1973, 6(3), 77-81

Wear Resistance of Electrodeposited Gold
L. B. Hunt, 1974, 7(1), 10-14

The Impact of Electronics on Gold Plating
anon., 1974, 7(3), 78-79

Problems in the Industrial Use of Electrodeposited Alloy Golds
D. R. Mason, 1974, 7(4), 104-105

Diffusion Barriers for Gold Plated Copper
L. B. Hunt, 1975, 8(2), 52

Reducing the Costs of Gold Plating
William S. Rapson & J. Foster, 1975, 8(2), 53-54

The Electroforming of Gold
A. Mohan, 1975, 8(3), 66-69

Gold Plating for the Electronics Industry
Morton Antler, 1975, 8(3), 86-87

Electrodeposited Gold Composites
Clive Larson, 1975, 8(4), 127-130

Wear Properties and Structure of Gold Alloy Deposits
F. H. Reid, 1976, 9(1), 11

Designing for Gold Plating
Harold Silman, 1976, 9(2), 38-44

High Speed Selective Gold Plating of Lead Frames
D. R. Mason, 1976, 9(2), 45

Gold-Cobalt Electrodeposits
S. J. Harris & E. C. Darby, 1976, 9(3), 81-83

Diffusion Barriers for Gold Plated Copper
L. B. Hunt, 1976, 9(4), 132-133

Alloy Gold Deposits for Electronic Applications
W. A. Fairweather, 1977, 10(1), 15-20

The Electrodeposition of Gold by Pulse Plating
Christoph J. Raub & A. Knodler, 1977, 10(2), 38-44

Comparative Studies of Electrolytes for Gold Plating
L. B. Hunt, 1977, 10(3), 77-78

High Speed Selective Brush Plating of Gold
Marv Rubinstein, 1978, 11(1), 3-7

Electromigration in Gold Film Conductors
William S. Rapson, 1978, 11(1), 7-8

Stable Gold Alloy Electrodeposits
John K. R. Page & Vivian G. Rivlin, 1978, 11(2), 43-48

Gold Plating Printed Circuit Connectors
anon., 1978, 11(4), 126

Electrodeposition of Hard Golds
William S. Rapson, 1978, 11(4), 132-133

Gold Electroplated Spectacle Frames
Alfons Knodler, Christoph J. Raub & Hans-Joachim Lubke, 1979, 12(1), 25-30

Inclusions in Cobalt-Hardened Electroplated Gold
William S. Rapson, 1979, 12(2), 52

Improvement of Gold Electrodeposits
K. G. A., 1979, 12(2), 73-74

Gold Plating with Pulsed Current
Frank H. Reid, 1979, 12(3), 114-115

Gold Plating in the Electronics Industry
J. W. Dini, 1979, 12(4), 159-160

The Properties of Gold Deposits Produced by DC, Pulse and Asymmetric AC Plating
J. W. Dini & H. R. Johnson, 1980, 13(1), 31-34

Gold Plating in the Electronics Industry
Alan Blair, 1981, 14(4), 167-168

Low-Carat Gold Plating
Clive Larson, 1982, 15 (I), 24

Electrodeposited and Rolled Gold
Alan J. Foster, 1982, 15(2), 64-68

Gold Contact Resistance
H. Becker & R. Schnabl, 1982, 15(3), 78-80

Plating in the Electronics Industry
Daniel R. Marx, 1982, 15(4), 118-119

Laser Enhanced Plating
Robert J. von Gutfeld & Lubomyr T. Romankiw, 1982, 15(4), 120-123

Bright Gold Electroplating Solutions
Guy Bacquias, 1982, 15(4), 124-129

Gold Electroforms and Heavy Electrodeposits
Dirk Withey, 1983, 16(3), 70-75

Gold Contacts to Semiconductor Devices
James W. Mayer, 1984, 17(1), 18-26

Electrodeposited Gold Composite Coatings
Clive Larson, 1984, 17(3), 86-93

Electroplated Gold in Microwave Integrated Circuits
I. R. Christie & W. Mazur, 1986, 19(2), 40-45

High Temperature Gold Deposition from Acid Cyanide Baths
Christoph J. Raub, Hamind R. Khan & Manfred Baumgartner, 1986, 19(2), 70-74

Understanding Gold Plating
Peter Wilkinson, 1986, 19(3), 7581

The Colour of Electroplated Golds
David]. Arrowsmirh, 1986, 19(4), 117-122

Modified (A) Stylus for Selective Brush Plating
G. M. Ganu & S. Mahapatra, 1987, 20(3), 66-67

Electroforming (the) of Gold and its Alloys
Anselm T. Kuhn & Leslie V. Lewis, 1988, 21(1), 17-23

Gold in Gallium Arsenide Die-Attach Technology
Giles Humpston & David M. Jacobson, 1989, 22(3), 79-91

Gold Plating of Critical Components for Space Applications: Challenges and Solutions
lndira Rajagopal, K. S. Rajam & S. R. Rajagopalan, 1992, 25(2), 55-66

Gold Electrodeposition within the Electronics Industry
Ian R. Christie & Brian P. Cameron, 1994, 27(1), 12-20

Present status & future developments in the electroplating of gold
Andreas Zielonka, 1996, 29(1), 17-18

Physical properties of gold electrodeposits
Stewart Helmsley, 1996, 29(1), 19-25

Some recent topics in gold plating for electronics applications
Yutaka Okinaka & Masao Hoshino, 1998, 31(1), 3-13

Significance on inclusions in electroplated gold films for electronics application
Yutaka Okinawa, 2000, 33(34), 117- 127

Some recent developments in non-cyanide gold plating for electronics applications
Masaru Kato & Yutaka Okinaka, 2004, 37(1/2), 37-44

Photocatalytic recovery of gold from spent cyanide plating bath solutions
Rafael van grieken, José Aguado, Maria-José López-Muňoz & Javier Marugán, 2005, 38(4), 180-187

Gold electrodeposition for microelectronic and microsystem applications
Todd A. Green, 2007, 40 (2), 105-114

Gold in Thick Film Hybrid Microelectronics
R. G. Finch, 1972, 5(2), 26-30

Gold in Hybrid Microelectronics
R. F. Russell, 1974, 7(2), 30-34

A New Gold Metallisation System for Beam Lead Technology
Gregory J. Highby, 1974, 7(2), 34

Gold in Semiconductor Technology
G. L. Davis, 1974, 7(4), 90-96

A New Generation of Thick-Film Gold Conductor Pastes
T. H. L., 1975, 8(1), 13-15

Some Trends in the Use of Gold for Electrical Con­tacts
K. E. Saeger & E. Vinaricky, 1975, 8(1), 2-6

Titanium-Gold Metallisation of Semiconductor Devices
I. E. C., 1975, 8(2), 55

Gold in Thick-Film Conductors
R. H. Caley, 1976, 9(3), 70-75

Gold in Hybrid Microelectronics
David T. Wall, 1977, 10(1), 21-23

Gold in Silicon: Characterisation and Infra-Red Detector Applications
Leonard Forbes, 1977, 10(2), 49-53

Gold Thick Film Conductors
M. V. Coleman & G. E. Gurnett, 1977, 10(3), 74-75

Diffusion of Gold in Silicon
William S. Rapson, 1977, 10(4), 114

Gold/Chromium Metallizations for Electronic Devices
Paul H. Holloway, 1979, 12(3), 99-105

The Role of Gold in Silicon Thyristors
David C. Northrop, 1980, 13(4), 134-143

Diffusion Barriers between Gold and Semiconductors
Ronald S. Nowicki, 1982, 15(1), 21-24

Gold Bonding Wire for Semiconductor Applications
Susumu Tomiyama & Yasuo Fukui, 1982, 15(2), 43-50

Gold in Electronic Components
Morton Antler, 1983, 16(1), 2-7

Epitaxy (the) of Gold
R. W. Vook & B. Oral, 1987, 20(1), 13-20

Introduction (an) to Gold Gettering in Silicon
Thomas. A. Baginski, 1987, 20(3), 47-53

New (A) High Strength Gold Bond Wire
Giles Humpston & David M. Jacobson, 1992, 25(4), 132-145

Multi-Chip Modules Using Etched Gold Conductors and a High Performance Low Permittivity Photosensitive Dielectric
Gary Shorthouse, Allan Berzins, Trevor Funnell & John Smyth, 1993, 26(4), 127-134

Luminescent gold compounds in optical oxygen sensors
Andrew mills, Anne Lepre, Brian C Theobald, Elizabeth Slade & Barry A Murrer, 1998, 31(2), 68-70

The essential role of gold in the fabrication of microwave electronics systems
G Humpston, 1999, 32(3), 75-79

The role of gold clusters in semiconductor microstructure fabrication
M Shirai, K Haraguchi, K Hiruma & T Katsuyama, 1999, 32(3), 80-84

Gold leads to PRTs for monitoring high temperatures
J R Greenwood, P R N Childs & P Chaloner, 1999, 32(3), 85-89 & 95

Current and future uses of gold in electronics
Paul Goodman, 2002, 35(1), 21-26

The future of gold in electronics
Tim Ellis, 2004, 37(1/2), 66-71

Measurement of gold ballbond intermetallic coverage
F Wulff, C D Breach, 2006, 39(4), 175-184

Intermetallic growth in gold ball bonds at 175°C: comparison between two 4N wires of different chemistry
C D Breach, F W Wulff, 2009, 42(2), 92-105

The use of gold for fabrication of nanowire structures
Maria E. Messing, Karla Hillerich, Jonas Johansson, Knut Deppert and Kimberly A. Dick
2009, 42, (3), 172-181

What is the future of bonding wire? Will copper entirely replace gold?
C.D. Breach, 2010, 43(3), 150-168

Recent developments in the preparation of nano-gold composite coatings
Renate Freudenberger, Andreas Zielonka, Martin Funk, Paul Servin, Rainer Haag, Teodora Valkova and Uwe Landau , 2010, 43(3), 169-180

Printed gold for electronic applications
P.T. Bishop, L.J. Ashfield, A. Berzins, A. Boardman, V. Buche, J. Cookson, R.J. Gordon, C. Salcianu and P.A. Sutton, , 2010, 43(3), 181-188

Recent progress in gold nanoparticle based non-volatile memory devices
Jang-Sik Lee, 2010, 43(3), 189-199

Adsorption of gold(III) from waste rinse 200 water of semiconductor manufacturing industries using Amberlite XAD-7HP resin
Nghiem Van Nguyena, Jae-chun Lee, Soo-kyoung Kim, Manis Kumar Jha, Kang-Sup Chung and Jinki Jeong, 2010, 43(3), 200-208

Recycling of gold from electronics: Cost-effective use through ‘Design for Recycling’
Christian Hagelüken and Christopher W Corti, 2010, 43(3), 209-220